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 TECHNICAL DATA
IN74HC258A
Quad 2-Input Data Selectors/Multiplexer with 3-State Outputs
High-Performance Silicon-Gate CMOS
The IN74HC258A is identical in pinout to the LS/ALS258. The device inputs are compatible with standard CMOS outputs; with pullup resistors, they are compatible with LS/ALSTTL outputs. This device selects a (4-bit) nibble from either the A or B inputs as determined by the Select input. The nibble is presented at the outputs in inverted form when the Output Enable pin is at a low level. A high level on the Output Enable pin switches the outputs into the high-impedance state. * Outputs Directly Interface to CMOS, NMOS, and TTL * Operating Voltage Range: 2.0 to 6.0 V * Low Input Current: 1.0 A * High Noise Immunity Characteristic of CMOS Devices
ORDERING INFORMATION IN74HC258AN Plastic IN74HC258AD SOIC TA = -55 to 125 C for all packages
PIN ASSIGNMENT LOGIC DIAGRAM
FUNCTION TABLE
Inputs Output Enable H PIN 16 =VCC PIN 8 = GND L L Select X L H Outputs Y0-Y3 Z A0-A3 B0-B3
X=don't care Z = high-impedance state A0-A3,B0-B3=the levels of the respective Nibble Inputs
Rev. 00
IN74HC258A
MAXIMUM RATINGS*
Symbol VCC VIN VOUT IIN IOUT ICC PD Tstg TL
*
Parameter DC Supply Voltage (Referenced to GND) DC Input Voltage (Referenced to GND) DC Output Voltage (Referenced to GND) DC Input Current, per Pin DC Output Current, per Pin DC Supply Current, VCC and GND Pins Power Dissipation in Still Air, Plastic DIP+ SOIC Package+ Storage Temperature Lead Temperature, 1 mm from Case for 10 Seconds (Plastic DIP or SOIC Package)
Value -0.5 to +7.0 -1.5 to VCC +1.5 -0.5 to VCC +0.5 20 35 75 750 500 -65 to +150 260
Unit V V V mA mA mA mW C C
Maximum Ratings are those values beyond which damage to the device may occur. Functional operation should be restricted to the Recommended Operating Conditions. +Derating - Plastic DIP: - 10 mW/C from 65 to 125C SOIC Package: : - 7 mW/C from 65 to 125C
RECOMMENDED OPERATING CONDITIONS
Symbol VCC VIN, VOUT TA tr, tf Parameter DC Supply Voltage (Referenced to GND) DC Input Voltage, Output Voltage (Referenced to GND) Operating Temperature, All Package Types Input Rise and Fall Time (Figure 1) VCC =2.0 V VCC =4.5 V VCC =6.0 V Min 2.0 0 -55 0 0 0 Max 6.0 VCC +125 1000 500 400 Unit V V C ns
This device contains protection circuitry to guard against damage due to high static voltages or electric fields. However, precautions must be taken to avoid applications of any voltage higher than maximum rated voltages to this high-impedance circuit. For proper operation, VIN and VOUT should be constrained to the range GND(VIN or VOUT)VCC. Unused inputs must always be tied to an appropriate logic voltage level (e.g., either GND or VCC). Unused outputs must be left open.
Rev. 00
IN74HC258A
DC ELECTRICAL CHARACTERISTICS (Voltages Referenced to GND)
VCC Symbol Parameter Test Conditions V Guaranteed Limit 25 C to -55C 1.5 3.15 4.2 0.3 0.9 1.2 1.9 4.4 5.9 3.98 5.48 0.1 0.1 0.1 0.26 0.26 0.1 0.5 85 C 1.5 3.15 4.2 0.3 0.9 1.2 1.9 4.4 5.9 3.84 5.34 0.1 0.1 0.1 0.33 0.33 1.0 5.0 125 C 1.5 3.15 4.2 0.3 0.9 1.2 1.9 4.4 5.9 3.7 5.2 0.1 0.1 0.1 0.4 0.4 1.0 10 A A V Unit
VIH
Minimum HighLevel Input Voltage Maximum Low Level Input Voltage Minimum HighLevel Output Voltage
VOUT=0.1 V or VCC-0.1 V IOUT 20 A VOUT=0.1 V or VCC-0.1 V IOUT 20 A VIN=VIH or VIL IOUT 20 A VIN=VIH or VIL IOUT 6.0 mA IOUT 7.8 mA
2.0 4.5 6.0 2.0 4.5 6.0 2.0 4.5 6.0 4.5 6.0 2.0 4.5 6.0 4.5 6.0 6.0 6.0
V
VIL
V
VOH
V
VOL
Maximum LowLevel Output Voltage
VIN=VIH or VIL IOUT 20 A VIN=VIH or VIL IOUT 6.0 mA IOUT .7.8 mA
IIN IOZ
Maximum Input Leakage Current Maximum ThreeState Leakage Current Maximum Quiescent Supply Current (per Package)
VIN=VCC or GND Output in High-Impedance State VIN= VIL or VIH VOUT= VCC or GND VIN=VCC or GND IOUT=0A
ICC
6.0
8.0
80
160
A
Rev. 00
IN74HC258A
AC ELECTRICAL CHARACTERISTICS (CL=50pF,Input tr=tf=6.0 ns)
VCC Symbol Parameter V Guaranteed Limit 25 C to -55C 100 20 17 160 32 18 150 30 26 110 22 20 60 12 10 10 15 85C 125C Unit
tPLH, tPHL
Maximum Propagation Delay, Nibble A or B to Output Y (Figures 1and 4) Maximum Propagation Delay , Select to Output Y (Figures 2 and 4) Maximum Propagation Delay , Output Enable to Output Y (Figures 3 and 5) Maximum Propagation Delay , Output Enable to Output Y (Figures 3 and 5) Maximum Output Transition Time, Any Output (Figures 1 and 4) Maximum Input Capacitance Maximum Three-State Output Capacitance (Output in High-Impedance State) Power Dissipation Capacitance (Per Package)
2.0 4.5 6.0 2.0 4.5 6.0 2.0 4.5 6.0 2.0 4.5 6.0 2.0 4.5 6.0 -
125 25 21 200 40 35 190 38 33 140 28 25 75 15 13 10 15
150 30 26 240 48 42 225 45 38 165 34 30 90 18 15 10 15
ns
tPLH, tPHL
ns
tPLZ, tPHZ
ns
tPZL, tPZH
ns
tTLH, tTHL
ns
CIN COUT
pF pF
Typical @25C,VCC=5.0 V 59 pF
CPD
Used to determine the no-load dynamic power consumption: PD=CPDVCC2f+ICCVCC
Figure 1. Switching Waveforms
Figure 2. Switching Waveforms
Rev. 00
IN74HC258A
Figure 3. Switching Waveforms
Figure 4. Test Circuit
Figure 5. Test Circuit
EXPANDED LOGIC DIAGRAM
Rev. 00
IN74HC258A
N SUFFIX PLASTIC DIP (MS - 001BB)
A
Dimension, mm
16 9 B
Symbol A
MIN 18.67 6.1
MAX 19.69 7.11 5.33
1
8
B C
F L
D F
0.36 1.14 2.54 7.62 0 2.92 7.62 0.2 0.38
0.56 1.78
C -T- SEATING
PLANE
G H
H J
N G D 0.25 (0.010) M T K M
J K L M N
10 3.81 8.26 0.36
NOTES: 1. Dimensions "A", "B" do not include mold flash or protrusions. Maximum mold flash or protrusions 0.25 mm (0.010) per side.
D SUFFIX SOIC (MS - 012AC) Dimension, mm
A 16 9
Symbol A
MIN 9.8 3.8 1.35 0.33 0.4 1.27 5.72 0 0.1 0.19 5.8 0.25
MAX 10 4 1.75 0.51 1.27
H
B
P
B C
1
G
8 C R x 45
D F G
-TD 0.25 (0.010) M T C M K
SEATING PLANE
J
F
M
H J K M P R
8 0.25 0.25 6.2 0.5
NOTES: 1. Dimensions A and B do not include mold flash or protrusion. 2. Maximum mold flash or protrusion 0.15 mm (0.006) per side for A; for B 0.25 mm (0.010) per side.
Rev. 00


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